According to South Korean media outlet The Korea Economic Daily, Samsung is reportedly considering further investment in its Taylor, Texas plant. Specifically, the company is said to be reviewing the addition of an advanced packaging line alongside its foundry and R&D facilities. The report n...

According to Aju Daily, SK Group Chairman Choi Tae-won notes that with the arrival of HBM4, the competitive landscape is set to shift, as that by 2026, the market will likely become more competitive and diversified. As the report highlights, SK hynix became the first company globally to deliver a...

While Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to major customers, the firm also notes that although GPUs will remain the main growth engine, ASICs are set to see even faster adoption in 2026. Building on this, Chosun Biz notes that th...

As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily. Sedaily suggests a...

As leading memory makers advance in HBM development, cooling technology is expected to become a key competitive factor once HBM5 enters commercialization—likely around 2029—according to Joungho Kim, a KAIST professor cited by The Elec. As noted in the report, Kim explains that while packaging...