According to ijiwei, citing CNpowder, as chip packaging technology advances rapidly, glass substrate TGV (Through Glass Via) has emerged as a focal point of industry attention. Glass substrates are gaining attention for their superior heat dissipation, conductivity, and flatness. As noted by Commer...

According to Commercial Times, industry sources suggest that Tesla and Apple are evaluating the use of glass substrates to improve chip performance. The report notes that if adopted, the move would likely target advanced, large-die applications such as autonomous driving platforms or AI server proc...

According to ETNews, Intel’s U.S. headquarters reportedly told the outlet that there has been no change to the company’s glass substrate development plan outlined in its 2023 roadmap. In response to speculation that it might cut staff as part of an exit from the business, Intel stated it does no...

According to South Korean outlet Business Post, sources indicate that Samsung is weighing investment in Intel’s packaging business — an area where Intel has a competitive edge — and is also exploring the use of Intel’s packaging production lines in the U.S. Sources highlight Samsung’s n...

According to South Korean outlet ETNews, citing industry sources, Intel has begun licensing its semiconductor glass substrate technology, enabling other companies to use it. The company is reportedly in talks with several glass substrate makers as well as materials, parts, and equipment suppliers, a...