With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates ...

As SEMICON Japan opens today (December 17), Nikkei reports that semiconductor heavyweights—including NVIDIA, Intel, Micron, and TSMC—are set to participate. Yet the biggest buzz may center on Rapidus, the Japanese foundry expected to unveil the world’s first interposer prototype cut from a sin...

According to ijiwei, citing CNpowder, as chip packaging technology advances rapidly, glass substrate TGV (Through Glass Via) has emerged as a focal point of industry attention. Glass substrates are gaining attention for their superior heat dissipation, conductivity, and flatness. As noted by Commer...

According to Commercial Times, industry sources suggest that Tesla and Apple are evaluating the use of glass substrates to improve chip performance. The report notes that if adopted, the move would likely target advanced, large-die applications such as autonomous driving platforms or AI server proc...

According to ETNews, Intel’s U.S. headquarters reportedly told the outlet that there has been no change to the company’s glass substrate development plan outlined in its 2023 roadmap. In response to speculation that it might cut staff as part of an exit from the business, Intel stated it does no...