China is stepping into the semiconductor glass substrate efforts. According to ETNews, industry sources say that Visionox, one of China’s leading display manufacturers, is set to ramp up investment in glass substrates this year. To support the move, the company has been building out its materials ...

Multiple industry players have been working to advance glass substrates, with LG among them, though the Korean company is reportedly recalibrating its timeline. According to ZDNet, LG had previously anticipated large-scale commercialization around 2028 but has since pushed its outlook to 2030, citin...

With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates ...

As SEMICON Japan opens today (December 17), Nikkei reports that semiconductor heavyweights—including NVIDIA, Intel, Micron, and TSMC—are set to participate. Yet the biggest buzz may center on Rapidus, the Japanese foundry expected to unveil the world’s first interposer prototype cut from a sin...

According to ijiwei, citing CNpowder, as chip packaging technology advances rapidly, glass substrate TGV (Through Glass Via) has emerged as a focal point of industry attention. Glass substrates are gaining attention for their superior heat dissipation, conductivity, and flatness. As noted by Commer...