Intel is expanding its advanced packaging footprint, as a company backed by Intel Capital is reportedly launching India’s first advanced 3D chip packaging facility. According to The Indian Express, the project—developed by U.S.-based 3D Glass Solutions (3DGS), in which Intel has invested, throug...

Commercialization of glass substrates is accelerating, with South Korean players and Intel increasingly competing head-on for leadership. According to Global Economic, sources indicate that Intel has laid out a glass substrate roadmap targeting 2030 to secure a technological edge, while Korean firms...

Apple may be moving to bring AI server chip development further in house, as recent developments suggest. According to Wccftech, citing The Elec, sources say Samsung Electro-Mechanics has supplied semiconductor glass substrate samples to Apple. Following earlier sample shipments to custom AI chip de...

As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its glass su...

As chip heavyweights such as Intel accelerate their push into glass substrates, Samsung is also edging closer to commercialization. According to ETNews, Samsung Electro-Mechanics has begun gearing up for market entry, with the project reportedly shifting from an advanced R&D unit to a business-f...