According to a report by Money DJ, TSMC, the global leader in semiconductor foundry, has recently notified domestic and international equipment suppliers to temporarily halt plans for equipment demand and deliveries scheduled for 2026, pending further updates. Industry sources cited by Money DJ i...

Currently, the global semiconductor industry is entering a new period of transformation. With the rapid development of AI, big data, cloud computing, and other technologies, the demand for high-performance computing chips, optical communication chips, and advanced packaging has surged, and recent re...

Driven by booming demand for AI chips, TSMC's advanced CoWoS (Chip on Wafer on Substrate) packaging faces a significant supply shortage. In response, TSMC is expanding its production capacity and is considering price increases to maintain supply chain stability. According to a recent report from ...

Taiwan's semiconductor manufacturing is making strides in advanced process and packaging expansion. TSMC’s new 2nm fab in Kaohsiung will hold a tool-in ceremony this November, followed by equipment installations in December. Meanwhile, ASE’s Siliconware Precision Industries is set to expand adva...

At TSMC’s earnings call on the 17th, the company revealed that its CoWoS (Chip-on-Wafer-on-Substrate) capacity will double each year in 2024 and 2025, but demand will continue to outpace supply. According to a report from Money DJ, the CoWoS expansion wave is expected to extend into 2026, promisin...