TSMC is actively expanding its advanced packaging CoWoS capacity, with progress reportedly on track, according to Economic Daily News. Industry sources estimate that, with the inclusion of production capacity from facilities acquired from Innolux (AP8) and those in Taichung, TSMC's CoWoS monthly ca...

According to a report by the Economic Daily News, TSMC has made significant progress in its silicon photonics strategy. The company recently achieved the integration of co-packaged optics (CPO) with advanced semiconductor packaging technologies, with sample deliveries expected to commence in early 2...

According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...