Subject


ASML


2025-10-21

[News] AMIES Rises in China’s Lithography Push, Reportedly Capturing 90% of Domestic Market

At the 2025 SEMiBAY event in China, several companies showcased the nation’s growing semiconductor capabilities, including subsidiaries of Huawei-linked equipment maker SiCarrier. Beyond SiCarrier, another firm drew attention for its advances in lithography. According to South China Morning Post, ...

2025-10-16

[News] Samsung Reportedly Purchasing Two ASML High-NA EUV Tools for Mass Production by 1H26

According to The Korea Economic Daily, Samsung is reportedly set to receive its first high-numerical-aperture (high-NA) EUV scanner — the Twinscan EXE:5200B — later this year, followed by a second unit in the first half of 2026. While the company already operates a research-use high-NA EUV tool ...

2025-10-15

[News] ASML Sees Sharp 2026 China Sales Drop but Says Total Revenue Won’t Fall Below 2025

According to Reuters, ASML warned of a sharp decline in demand from China in 2026, even as its third-quarter bookings exceeded market expectations. The report, citing CEO Christophe Fouquet, noted that while ASML does not expect its overall 2026 net sales to fall below 2025 levels, it foresees a sig...

2025-10-13

[News] China’s Toughest Rare-Earth Rules Hit Global Chip Supply: TSMC, ASML, Samsung on Alert

Right before TSMC’s earnings call this week, the U.S.-China chip war flared up again. On October 9, Beijing tightened rare-earth export rules, requiring case-by-case reviews for semiconductors and AI. According to China’s Ministry of Commerce, the rules cover 14nm-and-below logic chips, 256-laye...

2025-10-01

[News] imec Achieves Single-Patterning High-NA EUV Milestones, Appoints New CEO to Sharpen AI Focus

According to its press release, imec announced a leadership transition, appointing Patrick Vandenameele as its next CEO effective April 2026, while sharpening its focus on the rising demands of AI chipmaking. At the same time, the institute reported breakthroughs in single-patterning High-NA EUV lit...

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