According to a report from Taiwan's TechNews, NVIDIA has delivered impressive results in its latest financial report, coupled with an optimistic outlook for its financial projections. This demonstrates that the demand for AI remains robust for the coming quarters. Currently, NVIDIA's H100 and A100 c...

In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...

According to TrendForce research, driven by strong demand for 5G mobile phones, base stations, automobiles, and HPCs, the global output value of packaging and testing (including foundry and IDM) reached US$82.139 billion in 2021, or 25.83% YoY. This upward momentum is forecast to continue in 2022, t...