According to South Korean outlet Business Post, sources indicate that Samsung is weighing investment in Intel’s packaging business — an area where Intel has a competitive edge — and is also exploring the use of Intel’s packaging production lines in the U.S. Sources highlight Samsung’s n...

According to The Korea Economic Daily, sources indicate that Samsung Electronics will invest 25 billion yen (about $170 million) to establish an advanced chip packaging research and development center in Yokohama, Japan. The report adds that the City of Yokohama, which announced Samsung’s R&D ...

According to ZDNet, Samsung Electronics is developing System-on-Panel (SoP), an advanced semiconductor packaging technology. The report notes that if SoP advances quickly, Samsung could secure a role in Tesla’s next-generation Dojo packaging supply chain. At present, Tesla plans to have its “AI6...

According to Commercial Times, ASE said on the 11th that its subsidiary ASE Semiconductor will acquire a plant and related facilities from Taiwan’s GaAs foundry WIN Semiconductors in the Southern Taiwan Science Park, Kaohsiung, for NT$6.5 billion. Approved by the board, the purchase is aimed at e...

Taiwan's second-largest foundry, UMC, is stepping up its efforts in advanced packaging. According to a report from Commercial Times, sources say the company is considering acquiring the facility of TFT-LCD panel maker HannStar in the Southern Taiwan Science Park, which could be used to develop fut...