AI is fueling a surge in demand for advanced packaging, and TSMC’s capacity in this segment is reportedly running tight. According to Economic Daily News, with most of TSMC’s advanced packaging capacity taken up by NVIDIA, several major U.S. AI chipmakers have rushed to seek help from Powertech,...

AI is driving demand for advanced packaging, and Taiwan-based chip packaging giant ASE, which held its earnings call on the 30th, is moving quickly to ramp up operations. According to Economic Daily News, CFO Joseph Tung said the company’s 2025 capital expenditure will increase by US$1 billion to ...

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed tha...

According to South Korean outlet Business Post, sources indicate that Samsung is weighing investment in Intel’s packaging business — an area where Intel has a competitive edge — and is also exploring the use of Intel’s packaging production lines in the U.S. Sources highlight Samsung’s n...

According to The Korea Economic Daily, sources indicate that Samsung Electronics will invest 25 billion yen (about $170 million) to establish an advanced chip packaging research and development center in Yokohama, Japan. The report adds that the City of Yokohama, which announced Samsung’s R&D ...