TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

While TSMC has long dominated the advanced packaging landscape, Team Blue's technology is reportedly gaining traction. According to Wccftech, Intel’s EMIB and Foveros technologies are seeing growing interest, with Apple and Qualcomm posting job openings seeking talent experienced in its EMIB packa...

AI is fueling a surge in demand for advanced packaging, and TSMC’s capacity in this segment is reportedly running tight. According to Economic Daily News, with most of TSMC’s advanced packaging capacity taken up by NVIDIA, several major U.S. AI chipmakers have rushed to seek help from Powertech,...

AI is driving demand for advanced packaging, and Taiwan-based chip packaging giant ASE, which held its earnings call on the 30th, is moving quickly to ramp up operations. According to Economic Daily News, CFO Joseph Tung said the company’s 2025 capital expenditure will increase by US$1 billion to ...

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed tha...