Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...

According to South Korean outlet News1, Chinese tech giant Tencent has made it clear it has no intention of producing AI chips, stressing that it neither manufactures them now nor plans to in the future. This contrasts with other major Chinese tech firms, which have responded to U.S. restrictions on...

As major CSPs ramp up AI infrastructure and shift toward high-performance inference, demand for high-capacity storage keeps climbing—putting next-gen NAND development in the spotlight. Yet, according to ZDNet, Samsung Electronics is struggling to commercialize its ninth-generation (V9) high-capaci...

According to South Korean outlet Yonhap Infomax, shares of Japan’s NAND flash producer Kioxia have been rising sharply amid a supply shortage in the NAND market. The report notes that SK hynix — which invested KRW 3.9 trillion in Kioxia in 2018 — is now realizing significant valuation gains af...

With TSMC’s 2nm process set for mass production in H2 2025, several major clients are already on board, and Taiwan’s MediaTek is the latest to join. The smartphone chipmaker announced today the successful tape-out of its first flagship SoC on TSMC’s 2nm process, with mass production scheduled ...