Samsung has signed an MOU with Broadcom to collaborate across memory and foundry technologies, drawing industry attention to the evolving competitive landscape in the foundry business. According to Wccftech, while TSMC remains the undisputed leader in the global semiconductor market, Samsung's verti...

Intel's 18A process has gained an early external adopter. According to a press release, Japan's Hitachi has launched a silicon quantum computing collaboration with Intel K.K., Intel's Japanese subsidiary, and AIST (the National Institute of Advanced Industrial Science and Technology). Under the part...

As surging AI training and inference demand reshapes the semiconductor landscape, the server CPU market is also entering a new phase. Reuters reported that Intel and AMD are securing longer-term server CPU agreements with Chinese customers, while Intel confirmed it has already signed 10 long-term de...

China's DRAM champion CXMT is set to make its STAR Market debut later this month. According to MoneyDJ, citing Securities Times, the company will list on Shanghai's STAR Market on July 27, 2026. Based on its IPO price of RMB 8.66 per share, the offering values CXMT at approximately RMB 579.19 billio...

SK hynix is reportedly stepping up development of 3D-stacked DRAM, a next-generation memory technology for on-device AI. According to ZDNet, the company has reportedly begun recruiting 3D-Stacked DRAM-on-Logic Design Engineers through its U.S. subsidiary in San Jose, California. SK hynix is also sai...