Please note that this article cites information from Commercial Times, The Elec and TSMC. As GPU designs evolve toward denser chip-to-chip connectivity and faster data rates, optical transmission is taking on a bigger role. Foundry giants are also moving in, with TSMC’s COUPE silicon photonics p...

Please note that this article cites information from Chosun Ilbo, Newsis, News Tomato, and The Elec. JEDEC is reportedly considering relaxing standards governing next-generation HBM. According to Chosun Ilbo, sources indicate that JEDEC (Joint Electron Device Engineering Council) is weighing a ...

Please note that this article cites information from Aju News, Money Today Broadcasting, Hankyung and SK hynix. As memory giants race to bet on post-HBM technologies like HBF (High Bandwidth Flash), the man who is widely credited as the "father of HBM" is making a bold call. KAIST professor Joungh...

Please note that this article cites information from TechNews and The Elec. Shortly after its earlier announcement to discontinue thin small-outline package (TSOP) products in late May, Kioxia China, according to TechNews, issued another end-of-life notice to customers on March 31, stating that it...

Please note that this article cites information from ETNews and Global Economic. Micron is reportedly making the industry’s first attempt to stack graphics DRAM (GDDR). According to ETNews, sources indicate that the company has begun developing a new product that vertically stacks GDDR. Micron...