A high-end compound semiconductor substrate project with a total investment of RMB 2 billion (approximately USD 280 million) has been officially approved and will be established in Quzhou, Zhejiang Province, according to the Zhejiang Provincial Online Investment Project Approval and Supervision Plat...

As the memory upcycle broadens from HBM and leading-edge DRAM to legacy products, Taiwanese DRAM maker Nanya Technology is emerging as a key beneficiary as AI-driven demand expands across the market. Citing Nanya Tech Senior Vice President Joseph Wu, Liberty Times reports that AI inference is expect...

Hard disk drives (HDDs) are regaining attention as AI data center operators seek cost-effective, high-capacity storage to support rapidly growing data volumes. According to The Elec, although HDDs gradually lost ground to solid-state drives (SSDs), they are now poised for a rebound. The report says ...

With next-generation HBM advancing, attention is increasingly turning to the commercialization of hybrid bonding. According to The Elec, citing industry sources, Samsung Electronics is establishing a mass production line equipped with around 50 die-to-wafer (D2W) hybrid bonders at its Pyeongtaek cam...

According to TrendForce’s latest memory spot price trend report, DRAM spot prices edged higher this week as branded DDR4 chips attracted more inquiries, though cautious buying and limited supplier willingness kept trading activity subdued. In NAND Flash, the spot market remained under pressure ami...