Amid tightening supply conditions that have already prompted price hikes from memory makers and major CPU vendors, leading smartphone chip designer MediaTek is also moving in the same direction. According to TechNews, citing a customer notice, the company has acknowledged that it can no longer fully...

As memory giants accelerate their next-generation HBM race, Samsung Electronics has reportedly hit a key milestone. According to Yonhap News and ZDNet, its HBM4 has surpassed US$1 billion in revenue, making it the first product in the industry to reach the level just four months after entering mass ...

As AI data center deployments continue to accelerate, demand for high-speed optical interconnects has seen burgeoning growth, triggering a new wave of capacity expansion across the optical communications industry. On June 16, Dongshan Precision (DSBJ) announced that its wholly owned subsidiary, S...

As next-gen memory tech like HBM, SOCAMM, and 3D NAND increasingly need stronger chip design and advanced packaging capabilities, SK hynix, according to The Elec, has launched an unusually large-scale recruitment of design engineers. According to the report, the memory giant plans to hire a tripl...

While SanDisk is speeding up the development of High Bandwidth Flash (HBF), a next-generation architecture that vertically stacks NAND, the company is also advancing additional memory concepts aimed at addressing structural capacity constraints. According to a U.S. patent (US 12,430,274 B2) filed...