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2026-07-30

[News] Ahead of Cook’s Final Apple Earnings Call: Rising Memory Costs and Potential Sep. iPhone Price Hike in Focus

Apple is set to announce its FY26 third-quarter earnings soon, which will also mark Tim Cook's last appearance as CEO, with iPhone pricing and memory costs expected to be key areas of focus. According to Reuters, Apple's decision to hold iPhone prices steady is expected to deliver its strongest June...

2026-07-30

[News] Samsung Targets 60–70% Capacity Under LTAs; Five Key Customers Reportedly Include AWS, Microsoft, Google

Samsung’s earnings call delivered a clear vote of confidence in sustained AI memory demand, as the company disclosed, for the first time, concrete progress on its long-term agreements (LTAs). While Micron expects its Strategic Customer Agreements (SCAs) to account for around 50% of long-term memor...

2026-07-30

[News] TSMC’s 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028

TSMC has been pushing ahead with its next-generation manufacturing expansion. According to Commercial Times, Central Taiwan Science Park Administration Director Hsu Mao-hsin said on July 29 that construction of the company's 1.4nm fab at the site is ahead of schedule, with the first fab building exp...

2026-07-30

[News] Samsung’s DS Unit Delivers 99.7% of Q2 Profit amid Memory Boom; HBM4 Revenue Reportedly to Triple in Q3

Samsung Electronics delivered another record second quarter, with operating profit jumping 19-fold year over year to KRW 89.5 trillion. While memory’s role as the key earnings driver came as little surprise, the scale of its contribution was striking: the DS division accounted for a 99.7% of Samsu...

2026-07-30

[News] Mass Production and Capacity Expansion Accelerate, Reshaping the Foundry Landscape in Silicon Photonics

As AI computing power drives data transmission bandwidth demand to double every two years, the physical limits of copper interconnects are becoming increasingly apparent. How can the “traffic congestion” between chips be alleviated? An increasing number of wafer foundries are turning to one answ...

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