Ahead of TSMC’s earnings call later this week, the spotlight is once again on its advanced packaging roadmap—and CoWoS is no longer the only story. According to Commercial Times, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot line has already begun tool deliveries to R&D teams in February...

Recently, a joint research team from the National University of Defense Technology and the Institute of Metal Research, Chinese Academy of Sciences, has made a major breakthrough in wafer-scale growth and controllable doping of a new class of high-performance two-dimensional (2D) semiconductor mater...

Although JEDEC is expected to ease height restrictions for HBM, raising the limit to around 900 micrometers (µm) from 775 µm in HBM4, the industry continues to search for ways to overcome the structural limits of conventional HBM architectures. According to ET News, a “Vertical Die”-based adva...

ASE Holdings, the world’s leading OSAT provider, held a groundbreaking ceremony for its new Renwu facility in Kaohsiung, presided over by CEO Tien Wu, where he also outlined the company’s expansion plans. According to TechNews, six new plants are expected to break ground worldwide this year, mar...

Driven by AI demand, memory chips have entered a new price upcycle since the second half of 2025. What developments among China’s A-share memory-related companies are worth watching? According to Cailian Press, recent 2025 annual reports by major companies reflect varied performance across the val...