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2026-04-14

[News] Huawei Takes Early Lead in Horizontal Foldable Race vs Samsung and Apple, Eyes April Pura X Max Launch

Amid speculation that Apple’s first foldable iPhone could face delays, Huawei has moved early to stake its claim in the next wave of foldables. As Patently Apple notes, Huawei’s move is strategically significant—effectively setting the pace in the wide-format foldable race ahead of both Samsun...

2026-04-14

[News] China Reportedly Closes AI Performance Gap with U.S., Stanford Report Says; Anthropic Leads by Just 2.7%

The U.S.’s lead in AI may be narrowing. According to the latest report from the Stanford Institute for Human-Centered Artificial Intelligence (Stanford HAI), China has reportedly closed the performance gap with the U.S. The report notes that U.S. and Chinese models have traded the lead multiple ti...

2026-04-14

[News] Samsung 2nm Yields Reportedly at ~55%, Below Mass Production Threshold; Qualcomm May Opt for TSMC

Samsung’s 2nm yield challenges are resurfacing. According to Busan Ilbo, sources indicate that Samsung Foundry’s 2nm yields remain in the mid-50% range, falling short of the roughly 60% threshold typically required for stable mass production. After backend processing, effective yields are expec...

2026-04-14

[News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity

Memory is not the only segment where Samsung Electronics is pushing price increases amid surging AI demand. According to Financial News, the chip giant has reportedly raised prices for HBM4 logic dies by around 40–50% since early 2026, signaling a broader normalization of pricing across its semico...

2026-04-14

[News] Intel Launched World’s First Thinnest GaN Chiplet

On April 9, Intel Foundry Services announced a major technological breakthrough with the development of the world’s thinnest gallium nitride (GaN) chiplet. The silicon substrate has been reduced to just 19 micrometers—approx. one-fifth the diameter of a human hair. The chiplet is fabricated o...

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