A widening rift between Nexperia’s China and Netherlands operations is stirring concern across the global auto industry. According to Bits&Chips, sources say the European arm of Nexperia is accelerating efforts to expand its assembly and testing capacity outside China. The company’s Malaysia...

Beyond its September reveal of a multi-year Ascend AI chip roadmap through 2028—complete with proprietary HBM development—Huawei is making equally aggressive moves in enterprise storage. At its Huawei Connect Europe event in Madrid, the tech giant rolled out a sweeping refresh of its storage por...

At the SK AI Summit 2025, SK hynix revealed a bold roadmap outlining its memory plans beyond 2029. According to Wccftech, the roadmap spans two phases: one for 2026 to 2028, and another for 2029 to 2031. Across both periods, the company plans to roll out a full lineup of HBM, DRAM, and NAND products...

Shortly after announcing its “AI Megafactory” partnership with NVIDIA, where over 50,000 Team Green’s GPUs will drive chip production, Samsung is reportedly racing to clear NVIDIA’s HBM4 qualification. According to DealSite, the South Korean memory giant aims for final certification in early...

Recently, the New Energy Electrical Materials and Energy Storage Technology Cultivation Team from the School of Mechanical and Electrical Engineering at Xi’an University of Architecture and Technology proposed an innovative “molecular ordering design” strategy. Using this approach, the team de...