The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

Micron Technology CEO Sanjay Mehrotra said the memory supply crunch is only beginning as AI demand continues to grow. According to Wccftech, citing an interview with CNBC, he noted that AI remains in its early stages and that ongoing advances will require not only faster but also greater amounts of ...

As memory makers accelerate migration toward ~300-layer class NAND, Kioxia and SanDisk are reportedly pushing further ahead. According to EE Times Japan, the companies have achieved a world-first demonstration of quad-level cell (QLC) operation using a multi-stacked cell array CMOS (MSA-CBA) archite...

Memory Makers’ push to expand long-term contracts is reshaping memory market dynamics, with potential implications for pricing. According to Fnnews, citing analysts, the broader use of long-term supply agreements (LTAs) by Samsung Electronics may, paradoxically, drive prices higher and introduce a...

Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emergi...