Subject


Semiconductors


2026-04-30

[News] Researchers Reportedly Develop Ultrafast Laser Wiring for Glass Substrates, Targeting CPO Bottleneck

As glass substrates gain traction as a key material for next-generation AI semiconductor packaging, related technologies are drawing increasing industry attention. According to ETNews, Chonnam National University said a research team led by Professor Han Seung-hoe from the Department of Mechanical E...

2026-04-29

[Insights] Memory Spot Price Update: DDR5 Sees Sporadic Buying Interest; DDR4 Price Cuts Fail to Revive Demand

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, only DDR5 chips saw sporadic buying interest. DDR4 demand remained weak, with price cuts failing to revive purchasing activity. In the NAND flash segment, spot prices continued to drop over the past month, now arriv...

2026-04-29

[News] NAND Flash Controller Maker Silicon Motion Guides Up to 20% QoQ Sales Growth in 2Q After Record First Quarter

Amid an AI-driven supply squeeze lifting memory prices, chipmakers are posting strong Q1 results. NAND flash controller IC vendor Silicon Motion, cited by TechNews, delivered record revenue of $342.11 million in Q1 2026, up 23% QoQ and 105% YoY. Gross margin reached 47.2%, with net income of $53.85 ...

2026-04-29

[News] SK hynix Reportedly Completes 12-High Hybrid Bonding HBM Validation, Raises Yields for Mass Production

SK hynix’s yields for hybrid bonding HBM have reportedly improved, although the company did not disclose specific figures. According to The Elec, Kim Jong-hoon, Technical Leader at SK hynix, said validation of its 12-high HBM using hybrid bonding has been completed, adding that the company is now ...

2026-04-29

[News] U.S. Reportedly Moves to Block Chip Tool Shipments to China No.2 Foundry Hua Hong as It Seeks 7nm After SMIC

The U.S. has reportedly halted shipments of semiconductor equipment to facilities operated by China’s second-largest foundry, Hua Hong. According to Reuters, citing sources, the U.S. Department of Commerce has sent letters to several companies, including Lam Research, Applied Materials, and KLA, n...

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