As global memory supply remains extremely tight amid the AI boom, Samsung’s looming large-scale strike is seen as further intensifying the strain. According to South Korean media outlets News1 and The Dong-A Ilbo, citing analysts, disruptions could reach 3–4% for DRAM and 2–3% for NAND, based ...

Recently, China-based Ziener Tech has unveiled progress in sapphire substrate thinning, announcing that it has successfully reduced the substrate thickness of its 8-inch GaN-on-sapphire wafers to 50μm. In practical applications, heat dissipation has long been a key bottleneck limiting GaN device...

Amid disruptions in the Middle East, shortages of key materials are raising concerns across the global semiconductor supply chain. According to South China Morning Post, citing The Elec, the Strait of Hormuz has been effectively closed since early March, sharply curtailing supplies of naphtha—a ke...

DRAM scaling is becoming increasingly complex as the industry moves deeper into advanced process nodes below 10nm-class levels. The Elec reports that Samsung produced wafers using its 10a DRAM process in March and confirmed a working die during device characterization testing. Notably, this marks th...

ASML is reportedly planning job cuts. According to Times of India, citing Business Insider, the company is set to reduce its workforce by around 1,700 positions, or about 4% of its roughly 44,000 employees. The layoffs, announced in January alongside record full-year revenue of €32.7 billion, are ...