As Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging gains traction and draws strong market attention, the company is reportedly accelerating capacity expansion globally. An Investor.com report suggests Team Blue is advancing EMIB capacity expansion in parallel, with its Ore...

Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially provi...

Global memory vendors are stepping up efforts to develop DDR6. According to The Elec, citing sources, leading players including Samsung Electronics, SK hynix, and Micron have recently asked substrate suppliers to initiate early-stage DDR6 development. Key design details have been shared, enabling s...

Long-term agreements are no longer confined to upstream memory suppliers such as Samsung Electronics and SK hynix. At its latest earnings call, SanDisk outlined a clearer picture of its New Business Model (NBM) with customers. According to the transcript from Investing.com, the company has already s...

As advanced packaging has emerged as a key growth opportunity amid the AI chip boom, equipment players are also making strategic moves across the value chain. According to ijiwei, Hong Kong–listed ASMPT has entered into a share purchase agreement with U.S. semiconductor equipment giant Applied Mat...