A research team led by Professor Kong Wei at Westlake University has achieved wafer-scale, damage-free integration of single-crystal molybdenum disulfide (MoS₂) films onto flexible substrates, marking a shift in transfer and integration technology from conventional “wet” processes to a “dry�...

As Beijing continues pushing for greater semiconductor self-sufficiency, Chinese chip companies are allocating a larger share of revenue to R&D. According to South China Morning Post, first-quarter earnings show that China’s leading chipmakers devoted a higher proportion of revenue to research...

Vanguard International Semiconductor (VIS), a TSMC affiliate, commented on its future expansion plans, including those related to VSMC, its Singapore joint venture. According to UDN News, VIS Chairman Leuh Fang said the company is evaluating the construction of a second 12-inch fab, as existing capa...

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, buying interest remained concentrated on suppliers’ DDR5 chips, while mainstream DDR4 pricing largely moved sideways, with DDR4 1Gx8 3200MT/s chips edging down 0.25% this week. In the NAND flash segment, spot mark...

As agentic AI fuels a structural upswing in CPU demand, the memory architecture behind those processors is moving into equally sharp focus. As MRDIMM (Multiplexed Rank Dual In-line Memory Module) is emerging as one of the key solutions to that bottleneck, the Joint Electron Device Engineering Counci...