Subject


IC Manufacturing, Package&Test


2025-04-01

[News] UMC Denies GlobalFoundries Merger Rumors Amid U.S. Manufacturing Push, China Competition

IC Manufacturing, Package&Test

While TSMC makes strides in cutting-edge nodes and aims for 2nm mass production by year-end, its Taiwanese foundry counterpart, UMC, is rumored to be exploring a potential merger with U.S.-based GlobalFoundries, as per Nikkei and Reuters. However, the speculation has been denied by UMC, as it sta...

2025-04-01

[News] Japanese Firm Ajinomoto to Invest JPY 25 Billion by 2030 to Expand ABF Production for Advanced Packaging

IC Manufacturing, Package&Test

According to a TechNews report citing Nikkei, Japanese food and biotech company Ajinomoto plans to invest at least JPY 25 billion (approximately USD 166 million) by 2030 to boost production capacity of Ajinomoto Build-up Film (ABF)—a key material used in semiconductor substrates—by 50%. As th...

2025-03-31

[News] TSMC Reportedly Taps Suppliers for 1.4nm Equipment, with Baoshan Paving Way for Trial Production

IC Manufacturing, Package&Test

With its Kaohsiung plant in Southern Taiwan featuring 2nm groundbreaking today (March 31), TSMC’s next-gen 1.4nm seems to be making strides as well. According to the Economic Daily News, the foundry giant has recently informed suppliers to prepare for the necessary manufacturing equipment for the ...

2025-03-31

[News] China’s SiCarrier’s Bold Roadmap: ASML-Compatible Tools Reportedly Coming in 2026

IC Manufacturing, Package&Test

With SiCarrier stealing the show at SEMICON China, the company has disclosed more details on its product roadmap. The Chinese chip equipment firm claims to have developed lithography machines for 300-mm wafers on 28nm processes and plans to launch an upgraded version compatible with ASML and Applied...

2025-03-28

[News] Intel’s Comeback? NVIDIA and Broadcom Reportedly Eye 18A, with a Boosted Version in the Works

IC Manufacturing, Package&Test

With Lip-Bu Tan as Intel’s new CEO, aiming to restore its chipmaking edge and build a top-tier foundry, Team Blue’s 18A is gaining traction. Tom’s Hardware, citing guru, notes that NVIDIA and Broadcom, the world’s two top AI chip firms, are eyeing Intel’s 18A process. The reports indica...

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