As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development fra...

According to South Korea’s Maeil Business Newspaper, sources say Samsung plans to equip the base and slim Galaxy S26 models with the Exynos 2600, while the Ultra version will feature Qualcomm’s Snapdragon 8 Elite Gen 2. Samsung’s Exynos is reportedly showing a rebound in performance, accord...

According to Shanghai Securities News, China’s chip industry is reportedly seeing growth driven by AI. The report notes that among 102 A-share listed companies engaged in digital chip design, analog chip design, integrated circuit manufacturing, and IC packaging and testing, 66 posted profits in t...

While Intel’s 18A process continues to face speculation over yield issues—casting doubt on whether it can enter mass production by late 2025 as planned—Taiwan’s Acer has unexpectedly become the first laptop brand to unveil a device powered by Team Blue’s 18A-based Panther Lake processor, a...

As silicon photonics becomes a cornerstone of the AI era, AI chip leader NVIDIA and AMD have joined the competition alongside traditional foundries. Yet, Nikkei reports that Intel—the early pioneer in this sector—has seen its patent filings slump, with TSMC overtaking the U.S. giant since 2023. ...