With TSMC’s 2nm process set for mass production in H2 2025, several major clients are already on board, and Taiwan’s MediaTek is the latest to join. The smartphone chipmaker announced today the successful tape-out of its first flagship SoC on TSMC’s 2nm process, with mass production scheduled ...

Despite intensifying competition from Chinese rivals, global chipmakers continue to accelerate their SiC investments amid the AI boom. According to Wealth Magazine, NVIDIA is reportedly planning to replace traditional silicon interposers with silicon carbide in its next-generation Rubin architecture...

According to South Korean outlet FnNews, sources say Samsung has completed development of its next-generation smartphone application processor (AP), the Exynos 2600, with mass production expected to begin by the end of September. The report highlights that Samsung is showing strong confidence in the...

According to Economic Daily News, Infineon announced in March that it will launch RISC-V–based automotive microcontrollers (MCUs). Infineon plans to provide samples to partners for product development in 2026, with mass production slated for 2028–2029. Notably, these RISC-V–based MCUs will be ...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...