With CEO Jensen Huang calling it a “tremendous loss” to be blocked from China’s AI market, NVIDIA is gearing up to launch a toned-down version of its H20 AI chip for China as early as July, according to Reuters. The report says Team Green has already given major Chinese cloud providers a he...

On May 7, NEO Semiconductor announced a major breakthrough in its 3D X-DRAM technology series: the industry’s first 3D X-DRAM cell structures based on 1T1C and 3T0C architectures. According to NEO Semiconductor, the new technology is designed to deliver unprecedented density, power efficiency, ...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

Multiple sources have confirmed that Apple will, for the first time, equip part of its new iPhone 17 lineup with 12GB DRAM—opening the door to big gains for memory suppliers. South Korean outlet etnews reports that Samsung is poised to capture roughly 70% of total demand. It is worth noting tha...

With Micron, SanDisk, and Samsung already raising prices, SK hynix is now the latest memory giant to jump on the bandwagon. According to China’s Wallstreetcn, citing supply chain sources, SK hynix has increased its consumer DRAM chip/die prices by 12%. According to No Cut News, SK hynix said at...