As HBM suppliers weigh the shift to hybrid bonding for their 16-layer HBM4 products to address TSV yield bottlenecks, News1 Korea, citing industry analysts, reports that the hybrid bonding market is set to soar in the HBM4E era, with its share projected to hit around 50% by 2028. News1 Korea note...

Fresh off the massive boost from OpenAI’s Stargate project—with demand soaring to 900,000 DRAM wafers a month—South Korea’s memory titans are moving into expansion mode. The Bell reports that SK hynix plans to lift its DRAM wafer input to about 600,000 units per month in the second half of 2...

According to TrendForce's latest memory spot price trend report, regarding DRAM, spot quotes are steadily rising for mainstream chips such as DDR5 16Gb, DDR4 8Gb, DDR3, and eTT products, reflecting continued market confidence in future price hikes. Meanwhile, in NAND, optimism is making some spot tr...

Amid circulating rumors that NVIDIA may drop SOCAMM1 (Small Outline Compression Attached Memory Module) in favor of SOCAMM2 due to technical challenges, Etoday and DealSite indicate that the U.S. AI chip giant has placed next-year SOCAM module orders with Samsung, SK hynix, and Micron, likely distri...

With top memory makers reportedly raising prices amid tight supply, The Chosun Daily, citing TrendForce, highlights that by the end of Q3 2025, global DRAM inventories averaged just 3.3 weeks—matching the lows of 2018 and signaling a supercycle in the memory market could be on the way. The repo...