Subject


DRAM


2026-06-17

[Insights] Memory Spot Price Update: DDR3 Strengthens While DDR4 Faces Constraints and Spec Downgrading

DRAM

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, mainstream DDR4 chips largely traded sideways, while DDR3 spot prices continued to rise, partly supported by tight DDR4 availability and higher costs, which have prompted some consumer DRAM buyers to downgrade speci...

2026-06-15

[News] SK hynix Reportedly Pulls Forward HBM4E Sample Timeline, Eyeing June–July Shipments to Key Customers

DRAM

Samsung announced the start of HBM4E sampling in late May and later unveiled an HBM5 mock-up for the first time at COMPUTEX 2026. Against this backdrop, rival SK hynix is also stepping up its next-generation HBM push, with South Korean media outlet Newsis reporting that the memory giant has secured ...

2026-06-12

[News] Key Semiconductor Gas WF₆ Prices Reportedly Surge Over 200% as Supply Tightens Ahead of Japan Output Cuts

DRAM

While China’s rare earth export controls continue to draw market attention, another key semiconductor material is also seeing sharp price swings. According to chinastarmarket.cn, citing China’s General Administration of Customs, tungsten hexafluoride (WF₆) hit $149.79 per kilogram in April 202...

2026-06-12

[News] Micron Taps Bechtel, Intel Ohio Fab Builder, to Speed Up New York Mega Fab Construction

DRAM

Micron, which broke ground on its New York mega fab in January, has now moved to accelerate the project by naming its lead contractor. According to syracuse.com, engineering and construction giant Bechtel—also in charge of Intel’s Ohio semiconductor campus—will handle the engineering, procurem...

2026-06-11

[News] SK hynix Advances DRAM and NAND Roadmap, Targets 3x Wafer Output by 2034, 375-Layer NAND at Year-End

DRAM

While SK hynix had only last week outlined plans to double capacity over the next five years, the memory giant is now signaling an even more aggressive expansion across both DRAM and NAND. According to Nikkei, citing Chairman Chey Tae-won, the company is targeting a threefold increase in wafer outpu...

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