Subject


DRAM


2026-04-15

[Insights] Memory Spot Price Update: DRAM Spot Sellers Hold Firm Ahead of Mid-April Pricing, DDR4 Edges Lower 0.48%

DRAM

According to TrendForce’s latest memory spot price trend report, in the DRAM segment, most spot sellers held firm on quoted prices ahead of mid-April official pricing announcements. However, weak end-demand and cautious purchasing behavior kept overall trading activity subdued. As a result, the av...

2026-04-15

[News] HBM4 Strategies Diverge: Samsung Reportedly Chases 80% 1c DRAM Yield While SK hynix Trims Shipments by 30%

DRAM

As memory giants enter the final stage of HBM4 ramp-up ahead of NVIDIA’s Rubin launch, they are taking diverging approaches. According to Chosun Biz, Samsung is pushing to lift 1c DRAM yields for HBM4 toward 80%, while ZDNet reports that SK hynix is set to cut HBM4 volumes this year by 20–30%. ...

2026-04-14

[News] Samsung Reportedly Lifts HBM4 Logic Die Prices by 40–50% Amid AI Boom; 4nm at Full Capacity

DRAM

Memory is not the only segment where Samsung Electronics is pushing price increases amid surging AI demand. According to Financial News, the chip giant has reportedly raised prices for HBM4 logic dies by around 40–50% since early 2026, signaling a broader normalization of pricing across its semico...

2026-04-13

[News] Nanya Tech Reportedly Sees Double-Digit DRAM Price Gains in Q2, with Multiple Partnerships in Discussion

DRAM

While Nanya Technology drew market attention with a $2.5 billion private placement backed by SanDisk, Kioxia, and Solidigm, the Taiwanese DRAM maker also posted strong results on April 13. Notably, Next Apple, citing General Manager Lee Pei-ying, reports that DRAM prices in the second quarter are ex...

2026-04-13

[News] Samsung-Backed Vertical Die Research Reportedly Targets 10x I/O and 4x Bandwidth Gains for HBM

DRAM

Although JEDEC is expected to ease height restrictions for HBM, raising the limit to around 900 micrometers (µm) from 775 µm in HBM4, the industry continues to search for ways to overcome the structural limits of conventional HBM architectures. According to ET News, a “Vertical Die”-based adva...

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