[News] TSMC 3nm Monthly Wafer Starts to Hit 180K by Early 4Q26 on Strong Demand, 2–3 Months Ahead of Expectations

TSMC’s advanced-node capacity expansion is gathering pace. According to Economic Daily News, sources say that amid strong orders from major customers including NVIDIA, AMD, and Broadcom, TSMC could reach 180,000 3nm wafers per month by early in the fourth quarter, two to three months ahead of market expectations. Meanwhile, 2nm production remains on track to approach 100,000 wafers per month by year-end.

Driven by continued customer orders, TSMC reportedly increased its 3nm monthly wafer starts to nearly 150,000 in the first half of 2026. For 2nm, sources note that monthly wafer starts reached approximately 50,000 to 60,000 during the same period and could exceed 80,000 wafers per month by early in the fourth quarter.

As the report highlights, combined monthly wafer starts for TSMC’s 2nm and 3nm nodes could exceed 260,000 by early in the fourth quarter, helping drive continued revenue growth this year.

3nm Yield Gains Support Growth as 2nm Capacity Ramps

To support growing customer demand, TSMC continues to expand its advanced-node footprint. According to the report, the company has announced three additional 3nm fabs in Taiwan, Arizona, and Japan. It is also converting 5nm production equipment in Taiwan to support additional 3nm capacity.

As for 2nm, the report notes that TSMC said at its North America Technology Symposium earlier this year that five 2nm fabs—two in Hsinchu and three in Kaohsiung—will ramp in 2026. The company is targeting first-year 2nm wafer output to be 45% higher than the first-year output of its 3nm node in 2023, with 2nm capacity projected to grow at a compound annual growth rate (CAGR) of 70% from 2026 to 2028.

Meanwhile, TSMC has been pushing ahead with its next-generation manufacturing expansion. According to Commercial Times, sources say construction of the company’s 1.4nm fab is ahead of schedule, with the first fab building at the Central Taiwan Science Park expected to be completed before April 2027. Supply chain sources add that, if construction continues at its current pace, pilot production could begin as early as the start of 3Q27, with mass production expected in 2H28.

Read more

• [News] TSMC’s 1.4nm Fab Ahead of Schedule; First Building Expected Before Apr. 2027, Mass Production Seen by Mid-2028
• [News] TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom

(Photo credit: TSMC)