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Monthly Archives: April 2025
[Insights] Memory Spot Price Update: Top DRAM Suppliers Ending DDR3/DDR4 Output, Driving Price Surge
According to TrendForce’s latest memory spot price trend report, regarding DRAM, the three major DRAM suppliers have announced the impending end of production for DDR3 and DDR4 DRAM. This has triggered a rapid response in the spot market, with buyers …
[News] Samsung Drops Q2 Guidance Amid Tariff Woes, Reportedly Preps for NVIDIA’s Final HBM3E Test in June
Samsung Electronics reported a slight rise in first-quarter operating profit on Wednesday, as tariff-driven demand for smartphones and commodity chips helped offset weakness in its AI chip business, according to Reuters. However, it seems to remain cautious on potential tariff …
[News] Samsung Reportedly Nears 2nm Win with First Qualcomm Phone AP Deal in 3 Years
While Samsung has reportedly been wrestling with 3nm yield issues and the lack of orders from major clients, there may be light at the end of the tunnel. According to Sedaily, the company is now in the final stages of …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged 2nm, Qualcomm, Samsung
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[News] Trump Reportedly Plans Overhaul of Biden-Era AI Export Tiers in Favor of Direct Country Agreements
According to Reuters, sources say the Trump administration is looking to overhaul Biden-era restrictions on global access to AI chips, possibly scrapping the system that divides countries into tiers to determine how many advanced semiconductors they can receive. As noted …
[News] Intel Ramps Up Foundry Race: 14A Risk Production in 2027; 18A Variants Drop in 2026 and 2028
Shortly after TSMC announced plans to mass-produce A14 in 2028, Intel appears ready to compete with an aggressive roadmap for 14A and 18A. According to Intel’s press release, Team Blue is preparing two more 18A variants and has begun sharing …