With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generation CPU and GPU programs have drawn close attention. According to Commercial Times, AMD has already begun early preparations for its next-gene...

As AI workloads continue to scale, growing demand for memory capacity and bandwidth is pushing current GPU-HBM architectures toward their limits. According to ZDNet, a researcher at a major Korean memory manufacturer said memory and packaging companies are discussing a new approach that places GPUs...

With COMPUTEX approaching, it also marks nearly two years since Windows on Arm (WoA), which once entered the market amid expectations tied to Copilot+ PCs. According to Zhu Shi’s column on TechNews, although software support for Windows on Arm has not performed too poorly over the past two years, ...

Two months after its March earnings call, Micron is turning more upbeat on its outlook, while providing additional details on its custom HBM development progress. At the J.P. Morgan 54th Annual Global Technology, Media and Communications Conference, Micron's Global Operations EVP Manish Bhatia, via ...

Huawei is reportedly advancing proprietary packaging technology to boost high-capacity SSD density. According to BLOCKS&FILES, the company has produced 122TB SSDs despite lacking access to the latest 100+ layer 3D NAND from major suppliers. The report notes that, with U.S. restrictions limiti...