The AI packaging boom is reshaping South Korea’s HBM export flows, with Malaysia taking on a growing role. According to Chosun Biz, South Korea’s HBM-related exports to Malaysia have surged 5.7-fold in just one year. Annual exports stood at only around KRW 130 billion four years ago, but have no...

Alibaba is accelerating its push into AI infrastructure with new in-house chips. According to ijiwei, Alibaba’s T-Head has unveiled the Zhenwu V900, an AI chip designed for both training and inference. CEO Eddie Wu said it is currently China’s most powerful AI chip, delivering three times the co...

The rise of personal AI agents could change the computing requirements behind AI workloads. According to Wccftech, personal AI agents such as Meta’s Muse, which interact with websites and apps much like humans do, could represent the next major step in AI-driven productivity. The report estimates ...

As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule. Commercial Times, citing IC design sources, says pilot production at Baoshan, Hsinchu, could begin as early as 1Q27—nearly matching Intel’s timeline for bringing 14A into ...

Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro LEDs. The architecture features semiconductor dies embedded directly into a glass substrate, where Through-Glass-Via (TGV) within the substrate deliver power straight to th...