Dutch semiconductor equipment giant ASML has hinted at the potential for receiving significant orders from key customer TSMC in the coming quarters, according to a June 5th report from Reuters.
Reuters, citing information disclosed at a Jefferies-hosted investor call, noted that ASML’s CFO, Roger Dassen, expressed optimism about the progress of commercial discussions with TSMC, suggesting they are close to concluding. Reportedly, it is anticipated that ASML could receive significant orders for 2-nanometer related equipment as early as the second or third quarter. The report also mentioned that TSMC is expected to receive ASML’s latest High-NA EUV lithography equipment sometime this year.
According to the report, ASML predicts strong demand continuing until 2026, driven primarily by government-subsidized fabs being built around the world.
As per Reuters, each High-NA EUV machine costs over EUR 350 million, and ASML has already received dozens of orders from customers, including Intel, TSMC, Samsung Electronics, SK Hynix, and Micron. Among these, Intel was the first to place an order and will be the first to receive the equipment.
Per a report from Bloomberg, TSMC had previously expressed concerns about the high pricing of ASML’s latest equipment. Kevin Zhang, Senior Vice President of Business Development at TSMC, stated during a technical symposium in Amsterdam on May 14th that the next-generation process “A16,” scheduled for release in the second half of 2026, may not necessarily require the use of High-NA EUV lithography equipment.
Dr. Kevin Zhang further remarked that while he appreciates the capabilities of High-NA EUV, he finds its price tag to be unlikeable.
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(Photo credit: ASML)