Semiconductor Device

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape | TrendForce

New Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape

Jul 01, 2026 | PDF

As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key compan...

MLCC Price Jun. 2026 | TrendForce

MLCC Price Jun. 2026

Jun 30, 2026 | PDF

AI capacity crowding tightens high-end MLCC supply while consumer demand weakens under inflation. Channels and some Taiwanese/Chinese makers selectively raise prices, yet Japanese and Korean firms hol...

Mature Node Repricing: AI Squeeze Reshapes Foundry Landscape | TrendForce

Mature Node Repricing: AI Squeeze Reshapes Foundry Landscape

Jun 29, 2026 | PDF

AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.

2Q26 SiC Substrate Price Update | TrendForce

2Q26 SiC Substrate Price Update

Jun 29, 2026 | EXCEL

SiC Substrate Price Update

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 2 | TrendForce

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 2

Jun 26, 2026 | PDF

AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.

Key AI Components – Fiberglass Cloth | TrendForce

New Key AI Components – Fiberglass Cloth

Jun 26, 2026 | PDF

The surge in demand for AI chips and high-speed servers is driving the demand for high-end fiberglass cloth. However, constrained by technical barriers, equipment bottlenecks, and yield challenges, th...

AI Infra Market Bulletin – Jun. 25, 2026 | TrendForce

AI Infra Market Bulletin – Jun. 25, 2026

Jun 25, 2026 | PDF

AI drives data centers from air to liquid cooling. Vendors deploy high-density power and tech, boosting growth.

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 1 | TrendForce

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 1

Jun 23, 2026 | PDF

AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.

Display Driver IC Supply Chain and Market Status - 2Q26 | TrendForce

Display Driver IC Supply Chain and Market Status - 2Q26

Jun 23, 2026 | ZIP

This report contains 2 major sections: industry's“dynamic issues”and “trends of costs & prices”. In the section of "industry's dynamic issues", it analyzes 2 or 3 key topics of driver IC and related s...

MLCC Market Bulletin - Jun. 18, 2026 | TrendForce

MLCC Market Bulletin - Jun. 18, 2026

Jun 18, 2026 | PDF

AI-driven demand is crowding out capacity and pressuring MLCC supply, while high interest rates and inflation weigh on consumer electronics recovery. Distributor hoarding and price hikes have triggere...

2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy | TrendForce

New 2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy

Jun 18, 2026 | PDF

Global semiconductor supply chains are shifting from efficiency to resilience amid escalating export controls, driving manufacturing diversification. Governments race to subsidize domestic ecosystems,...

MLCC Market Bulletin - Jun. 8, 2026 | TrendForce

MLCC Market Bulletin - Jun. 8, 2026

Jun 08, 2026 | PDF

Strong AI demand concentrates high-end MLCC specifications while weak consumer electronics shift capacity toward AI servers. CSP custom ASICs trigger frequent design changes, tightening supply and ext...

MLCC Price May 2026 | TrendForce

MLCC Price May 2026

May 29, 2026 | PDF

AI demand tightens high-end MLCC supply, prompting agents to raise prices and strengthening supplier bargaining power. Geopolitical risks and inflation raise costs, curbing ODM leverage, with high-end...

2026 Energy Storage Turning Point: AIDC Fuels Dual-Engine Demand Growth | TrendForce

New 2026 Energy Storage Turning Point: AIDC Fuels Dual-Engine Demand Growth

May 27, 2026 | PDF

The global energy storage industry will reach a pivotal turning point in 2026. The explosive growth of artificial intelligence data centers (AIDC) is creating a lucrative, high-growth blue ocean for a...

2026 AI Optical Trends: Co-Packaged Optics & Silicon Photonics | TrendForce

New 2026 AI Optical Trends: Co-Packaged Optics & Silicon Photonics

May 27, 2026 | PDF

Optical interconnects in AI data centers are shifting from legacy pluggable optics toward LPO, CPO and OCS. LPO streamlines the signal chain to improve power while keeping a pluggable model, CPO co‑pa...

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