Semiconductor Device

Overcoming the Memory Bottleneck: CXL Expansion and KV Cache Compression Innovations | TrendForce

New Overcoming the Memory Bottleneck: CXL Expansion and KV Cache Compression Innovations

Jul 15, 2026 | PDF

During the first half of 2026, surging demand for KV Cache coupled with constrained memory supply resulted in severe memory bottlenecks. To resolve the KV Cache bottlenecks, industry players are seeki...

MLCC Market Bulletin - Jul. 9, 2026 | TrendForce

MLCC Market Bulletin - Jul. 9, 2026

Jul 09, 2026 | PDF

Strong demand for AI servers and in‑house chip platforms is driving structural shortages in high‑end and mid‑high‑cap MLCCs. Inflation and high interest rates are suppressing end‑market consumption, f...

SLC NAND Price Surge: Global Capacity Gap & Substitution Wave in 2H 2026 | TrendForce

SLC NAND Price Surge: Global Capacity Gap & Substitution Wave in 2H 2026

Jul 06, 2026 | PDF

As memory giants realign capacity toward high-value advanced processes, mature node capacity faces severe compression. This structural shift has caused severe shortages in legacy chips, compelling ind...

AI Server Industry Analysis-2Q26 | TrendForce

AI Server Industry Analysis-2Q26

Jul 03, 2026 | PDF

AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape | TrendForce

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape

Jul 01, 2026 | PDF

As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key compan...

MLCC Price Jun. 2026 | TrendForce

MLCC Price Jun. 2026

Jun 30, 2026 | PDF

AI capacity crowding tightens high-end MLCC supply while consumer demand weakens under inflation. Channels and some Taiwanese/Chinese makers selectively raise prices, yet Japanese and Korean firms hol...

Mature Node Repricing: AI Squeeze Reshapes Foundry Landscape | TrendForce

Mature Node Repricing: AI Squeeze Reshapes Foundry Landscape

Jun 29, 2026 | PDF

AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 2 | TrendForce

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 2

Jun 26, 2026 | PDF

AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.

Key AI Components – Fiberglass Cloth | TrendForce

New Key AI Components – Fiberglass Cloth

Jun 26, 2026 | PDF

The surge in demand for AI chips and high-speed servers is driving the demand for high-end fiberglass cloth. However, constrained by technical barriers, equipment bottlenecks, and yield challenges, th...

AI Infra Market Bulletin – Jun. 25, 2026 | TrendForce

AI Infra Market Bulletin – Jun. 25, 2026

Jun 25, 2026 | PDF

AI drives data centers from air to liquid cooling. Vendors deploy high-density power and tech, boosting growth.

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 1 | TrendForce

Probe Card Tech Upgrade & Market Reshaped by AI Packaging-Part 1

Jun 23, 2026 | PDF

AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.

Display Driver IC Supply Chain and Market Status - 2Q26 | TrendForce

Display Driver IC Supply Chain and Market Status - 2Q26

Jun 23, 2026 | ZIP

This report contains 2 major sections: industry's“dynamic issues”and “trends of costs & prices”. In the section of "industry's dynamic issues", it analyzes 2 or 3 key topics of driver IC and related s...

MLCC Market Bulletin - Jun. 18, 2026 | TrendForce

MLCC Market Bulletin - Jun. 18, 2026

Jun 18, 2026 | PDF

AI-driven demand is crowding out capacity and pressuring MLCC supply, while high interest rates and inflation weigh on consumer electronics recovery. Distributor hoarding and price hikes have triggere...

2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy | TrendForce

2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy

Jun 18, 2026 | PDF

Global semiconductor supply chains are shifting from efficiency to resilience amid escalating export controls, driving manufacturing diversification. Governments race to subsidize domestic ecosystems,...

MLCC Market Bulletin - Jun. 8, 2026 | TrendForce

MLCC Market Bulletin - Jun. 8, 2026

Jun 08, 2026 | PDF

Strong AI demand concentrates high-end MLCC specifications while weak consumer electronics shift capacity toward AI servers. CSP custom ASICs trigger frequent design changes, tightening supply and ext...

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