HBM Industry Analysis - 3Q25

Last Modified

2025-07-25

Update Frequency

Quarterly

Format

PDF

The report highlights major manufacturers' HBM capacity strategies, facility expansions, and market trends driven by AI, offering strategic insights for the industry.

Key Highlights

SK hynix expands HBM capacity via facility upgrades and resource reallocation in Korea
Micron focuses TSV and stacking capacity growth in Taiwan, Singapore, and the US, adapting to policy incentives
Market demand projections are based on AI chip shipment trends and key industry players
Consumption patterns shift with product upgrades and timeline adjustments, impacting forecasts
The analysis informs industry strategy with insights on capacity and market changes

Memory Suppliers' Figures for HBM Output and TSV Processing Capacity
- Three Major Memory Suppliers' HBM Output Figures and Corresponding Market Shares
Analysis of HBM Generations and Die Stack Levels
Updates on New Backend Packaging and Testing Facilities
Analysis of HBM Demand
- Distribution of HBM Bit Consumption
HBM S/D Ratio
- HBM S/D Ratio
Analysis on Prices and Revenue of HBM
- Blended ASP of HBM
- Revenue Share of HBM Products
- Revenue Share of HBM Suppliers