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HBM Industry Analysis - 2Q26

Last Modified

2026-04-30

Update Frequency

Quarterly

Format

PDF

HBM grows strongly in 2026 as CSP/ASIC demand lifts HBM3e prices; SK hynix leads, Samsung rebounds, Micron expands TSV.

Key Highlights

Suppliers: SK hynix leads; Samsung rebounds; Micron expands TSV.
Demand: NVIDIA tops; Google fastest-growing; AWS/META cautious.
HBM3e: CSP/ASIC orders keep ASP near flat YoY.
HBM4: ships 1Q26, ramps 2H26; IO upgrade delays quals.
2027: Rubin and HBM4e drive shift to next-gen HBM.

Table of Contents

Introduction
Memory Suppliers' Figures for HBM Output and TSV Processing Capacity
- Three Major Memory Suppliers' HBM Output Figures and Corresponding Market Shares
Analysis of HBM Generations and Die Stack Levels
Updates on New Backend Packaging and Testing Facilities
Analysis of HBM Demand
- Distribution of HBM Bit Consumption in 2025 and 2026
HBM S/D Ratio
- HBM S/D Ratio
Analysis on Prices and Revenue of HBM
- Blended ASP of HBM
- Revenue Share of HBM Products
- Revenue Share of HBM Suppliers

<Total Pages: 16>

Distribution of HBM Bit Consumption in 2025 and 2026

Category: AI/HBM/Server

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