TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
Global cloud data centers rapidly adopt liquid cooling as the standard for AI server cooling, driving supply chain growth.
The AI server market is growing rapidly due to generative AI, driven by cloud service providers. AI server shipments are expected to continue to outpace general-purpose servers and account for a signi...
In 2025, the electronics industry sees diverging trends: strong AI demand, weak consumer devices, early pull-in erases seasonality, and future growth slows.
Server module prices rise as CSPs drive demand; DDR4 faces tight supply and price hikes, DDR5 prices lifted by high-capacity modules. However, demand growth is expected to slow in 2026, leading to a p...
The report highlights major manufacturers' HBM capacity strategies, facility expansions, and market trends driven by AI, offering strategic insights for the industry.
US policy shifts ease chip export bans, boosting AI server shipments growth; major tech firms expand AI data centers globally.
NVIDIA has resumed sales of its AI chip H20 in China, prioritizing this year's targets. TSMC's production capacity could be a bottleneck. NVIDIA will also launch the Blackwel...
eMMC/UFS contract prices for the third quarter of 2025 are projected to remain flat. Fading policy benefits, tariff impacts, and weak consumer demand limit upward movement. Suppliers are shifting focu...
Cloud data center expansions drive upgrades in power and cooling supply chains. BBU lithium batteries and liquid cooling are key trends, offering growth opportunities for related suppliers.
The three main HBM suppliers are enhancing technology and customization to meet AI-driven demands, with growth in collaboration expected.
NVIDIA H20 may resume sales to China, boosting AI GPU supply and demand for HBM and GDDR. US policy shift favors Chinese adoption of high-end AI chips. New products like RTX PRO 6000 will further supp...
This issue highlights server ODMs, CPUs, GPUs, and key changes in the thermal supply chain. AI servers are the focus, CSPs keep ordering, ODMs prep for new platforms, Meta and Google push in-house CPU...
The AI ASIC market is rapidly expanding, with TPUs shifting from internal use to external commercialization due to their energy efficiency and customization. Leading cloud and tech firms actively deve...
MRDIMM addresses high-core CPU and AI needs, enhancing memory efficiency, but standards, cost, and support limit adoption.
In 2025, global AI chips focus on high-end HBM memory; NVIDIA’s new Blackwell platform drives growth, amid geopolitical limits and steady AI server demand, with rapid HBM technology evolution toward H...
