TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
NVIDIA has resumed sales of its AI chip H20 in China, prioritizing this year's targets. TSMC's production capacity could be a bottleneck. NVIDIA will also launch the Blackwel...
eMMC/UFS contract prices for the third quarter of 2025 are projected to remain flat. Fading policy benefits, tariff impacts, and weak consumer demand limit upward movement. Suppliers are shifting focu...
Cloud data center expansions drive upgrades in power and cooling supply chains. BBU lithium batteries and liquid cooling are key trends, offering growth opportunities for related suppliers.
The three main HBM suppliers are enhancing technology and customization to meet AI-driven demands, with growth in collaboration expected.
NVIDIA H20 may resume sales to China, boosting AI GPU supply and demand for HBM and GDDR. US policy shift favors Chinese adoption of high-end AI chips. New products like RTX PRO 6000 will further supp...
This issue highlights server ODMs, CPUs, GPUs, and key changes in the thermal supply chain. AI servers are the focus, CSPs keep ordering, ODMs prep for new platforms, Meta and Google push in-house CPU...
The AI ASIC market is rapidly expanding, with TPUs shifting from internal use to external commercialization due to their energy efficiency and customization. Leading cloud and tech firms actively deve...
MRDIMM addresses high-core CPU and AI needs, enhancing memory efficiency, but standards, cost, and support limit adoption.
In 2025, global AI chips focus on high-end HBM memory; NVIDIA’s new Blackwell platform drives growth, amid geopolitical limits and steady AI server demand, with rapid HBM technology evolution toward H...
DDR4 prices rise due to EOL effects and buying demand, focusing on certain players. DDR5 sees slight growth from CSP order returns with steady pricing. AMD's server market penetration grows, bene...
North American CSPs & OEMs drive AI market growth; new Blackwell platform shipments will expand. China's market faces variables due to geopolitics affecting AI solution supply. Overall AI ser...
Cloud giants accelerate self-developed AI ASICs, boosting market scale and projects. Driven by internal needs and geopolitics, ASIC share will rise, with next-gen ASICs from major cloud providers expe...
As power consumption and thermal density in AI servers soar, traditional air-cooling methods are increasingly inadequate when it comes to meeting the demand of high-performance computing (HPC). Liquid...
HBM4 pricing shows a premium over HBM3e due to increased complexity and cost in manufacturing and design.
Amazon is rapidly expanding its self-developed AI ASIC servers to bolster AWS's cloud AI training competitiveness. The new generation Trainium chips feature diversified designs ca...
