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HBM Market Bulletin - Jun. 13, 2025

Last Modified

2025-06-13

Update Frequency

Monthly

Format

PDF

HBM4 pricing shows a premium over HBM3e due to increased complexity and cost in manufacturing and design.

Key Highlights

As HBM3e supply and demand outlook becomes clear in 2025, market focus shifts to HBM4 starting in 2026.
HBM4 commands higher prices driven by doubled I/O counts, leading to larger die size and more complex packaging.
Advanced process nodes elevate costs, and uncertainties in yield and certification remain.
HBM4 offers multiple stacking options to meet diverse needs, balancing challenges with growth opportunities.

Table of Contents

HBM4 Is Expected to Carry a Price Premium Compared with HBM3e Primarily Due to Increased Costs for Both Frontend and Backend Processes
- Suppliers' Roadmaps for Advancing Bandwidths of HBM Products
HBM4 Comprises of 8hi, 12hi, and 16hi for Demand of Various Capacities
- HBM Stacking Process Technology Roadmap
Differentiated Maturity in Frontend HBM4 Processes among Three Major Suppliers

<Total Pages: 3>

Suppliers’ Roadmaps for Advancing Bandwidths of HBM Products

Sector: AI Server / Data Center Memory & Storage

Tag: HBM Advanced Packaging HBM3 HBM4 Market Bulletin Pricing Power Supply & Demand Yield Rate

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