Research Reports

Research Reports

HBM Market Bulletin - Jun. 13, 2025

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Last Modified

2025-06-13

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Update Frequency

Monthly

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Format

PDF



Overview

HBM4 pricing shows a premium over HBM3e due to increased complexity and cost in manufacturing and design.

Key Highlights

  • As HBM3e supply and demand outlook becomes clear in 2025, market focus shifts to HBM4 starting in 2026.
  • HBM4 commands higher prices driven by doubled I/O counts, leading to larger die size and more complex packaging.
  • Advanced process nodes elevate costs, and uncertainties in yield and certification remain.
  • HBM4 offers multiple stacking options to meet diverse needs, balancing challenges with growth opportunities.

Table of Contents

  1. HBM4 Is Expected to Carry a Price Premium Compared with HBM3e Primarily Due to Increased Costs for Both Frontend and Backend Processes
    • Suppliers' Roadmaps for Advancing Bandwidths of HBM Products
  2. HBM4 Comprises of 8hi, 12hi, and 16hi for Demand of Various Capacities
    • HBM Stacking Process Technology Roadmap
  3. Differentiated Maturity in Frontend HBM4 Processes among Three Major Suppliers

<Total Pages: 3>

Suppliers’ Roadmaps for Advancing Bandwidths of HBM Products





USD $20,000

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