Research Reports
HBM Market Bulletin - Jun. 13, 2025
Last Modified
2025-06-13
Update Frequency
Monthly
Format
Overview
HBM4 pricing shows a premium over HBM3e due to increased complexity and cost in manufacturing and design.
Key Highlights
- As HBM3e supply and demand outlook becomes clear in 2025, market focus shifts to HBM4 starting in 2026.
- HBM4 commands higher prices driven by doubled I/O counts, leading to larger die size and more complex packaging.
- Advanced process nodes elevate costs, and uncertainties in yield and certification remain.
- HBM4 offers multiple stacking options to meet diverse needs, balancing challenges with growth opportunities.
Table of Contents
- HBM4 Is Expected to Carry a Price Premium Compared with HBM3e Primarily Due to Increased Costs for Both Frontend and Backend Processes
- Suppliers' Roadmaps for Advancing Bandwidths of HBM Products
- HBM4 Comprises of 8hi, 12hi, and 16hi for Demand of Various Capacities
- HBM Stacking Process Technology Roadmap
- Differentiated Maturity in Frontend HBM4 Processes among Three Major Suppliers
<Total Pages: 3>
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