TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandw...
This report show Google and AWS driving strong HBM demand, with capacity expanding across generations; META and Huawei join as large buyers.
Global AI server market stays strong as major cloud providers expand infrastructure and platforms; GPU and self-developed ASIC demand rises amid regional dynamics.
This report analyzes the capital expenditure structure of a typical hyperscale AI data center, breaking down the spending into physical infrastructure, IT computing facilities, and networking equipmen...
2026 NAND Flash: AI drives explosive enterprise SSD demand, offsetting weak consumer markets. HDD shortages compel a shift to high-capacity QLC SSDs. Despite bit growth, supply for these remains struc...
TrendForce forecasts a structural memory price hike by 2026. Strong AI server demand and profit-first supplier strategies lead to capacity shifting towards high-margin applications, driving widespread...
The server market notes North American cloud providers as the growth engine, with enterprise OEMs cautious, and AI servers plus efficient cooling as priorities. Key players like Compal and Supermicro...
AI servers and chips up; GPU and in‑house ASIC advance. Liquid cooling grows; storage favors higher capacity.
Sept 2025 server DRAM contract prices surged due to persistent CSP demand, with DDR5/DDR4 increasing. 8000MT/s modules will see accelerated adoption. Strong 2026 demand and tight supply are set to ext...
Cloud providers lift AI Capex to new highs; rack-scale GPU and custom ASICs rise, liquid cooling spreads.
The report highlights AI data center expansion by U.S. and Chinese CSPs. U.S. firms scale globally and invest more at home, while Chinese firms expand with self-developed chips, but both prioritize en...
U.S. inflation pressures and labor market weakness lead to rate cuts; traditional demand drops while AI servers and automotive electronics grow, causing supply chain segmentation.
Robust AI server demand, driven by NVIDIA, AMD, and CSP custom ASICs, propels market growth. DDR5 is mainstream, yet DDR4 sees extended life and price rebound from storage needs. AMD and ARM challenge...
Analyst summary: Samsung completed NVIDIA certification for HBM3e and began limited shipments; HBM3e will be the near‑term mainstream. Supplier competition is intensifying while HBM4 upgrades are expe...
4Q25 memory prices continue upward. Strong AI demand from US CSPs and HDD shortages boosting enterprise NAND Flash are key. Suppliers prioritize profit, tightening old process supply.
