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HBM Market Bulletin - Nov. 17, 2025

Last Modified

2025-11-17

Update Frequency

Monthly

Format

PDF

AI demand lifts memory; fab limits push per-wafer pricing. HBM tight; suppliers favor DDR5; extras may rise.

Key Highlights

Suppliers expand advanced packaging/back-end, repurpose fabs, add new sites.
Pricing shifts to per-wafer as capacity stays tight; per-bit less relevant.
HBM hit by die size and yield limits; supply tight; extras may face hikes.
Data centers lift DDR5/mobile; some prioritize conventional DRAM allocation.
Overbuying is being digested; mature lines pressured; new gen builds inventory.

Table of Contents

Introduction
Samsung’s Market Share Is Expected to Rebound, While SK hynix and Micron Continue Maintain Steady Capacity Expansions
Value of Wafers Set as Pricing Anchor for Suppliers’ Products under Restricted Capacity
- ASP per wafer of HBM and DDR5
Possible Upward Price Revisions for HBM amidst Ongoing Tension in Availability
- HBM Balance between Shipment, Consumption and Safety Purchase

<Total Pages: 3>

ASP per wafer of HBM and DDR5

Category: AI Server/HBM/Server

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