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HBM Market Bulletin - Nov. 17, 2025
Last Modified
2025-11-17
Update Frequency
Monthly
Format
AI demand lifts memory; fab limits push per-wafer pricing. HBM tight; suppliers favor DDR5; extras may rise.
Key Highlights
- Suppliers expand advanced packaging/back-end, repurpose fabs, add new sites.
- Pricing shifts to per-wafer as capacity stays tight; per-bit less relevant.
- HBM hit by die size and yield limits; supply tight; extras may face hikes.
- Data centers lift DDR5/mobile; some prioritize conventional DRAM allocation.
- Overbuying is being digested; mature lines pressured; new gen builds inventory.
Table of Contents
- Introduction
- Samsung’s Market Share Is Expected to Rebound, While SK hynix and Micron Continue Maintain Steady Capacity Expansions
- Value of Wafers Set as Pricing Anchor for Suppliers’ Products under Restricted Capacity
- ASP per wafer of HBM and DDR5
- Possible Upward Price Revisions for HBM amidst Ongoing Tension in Availability
- HBM Balance between Shipment, Consumption and Safety Purchase
<Total Pages: 3>
Category: AI/HBM/Server
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