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According to the latest report by TrendForce, the global notebook shipments for 3Q18 are estimated to increase slightly by 3.9% QoQ, reaching 42.68 million units. Compared with the previous forecast of 5~6% growth, this projection has been adjusted 2% downward due to the shortage of Intel CPU.
DRAMeXchange, a division of TrendForce, reports that the bit output from the NAND Flash industry increased steadily in 3Q18, as suppliers raised the yields of their 64/72-layer 3D NAND production. NAND Flash demand, however, had yet to catch up with supply despite the year-end busy season. The shortage of Intel CPUs and the lower-than-expected sales of new iPhone devices have respectively stifled the demand growths related to notebook PCs and smartphones. Also, the US-China trade dispute has been a negative influence on the whole market. Because the NAND Flash market had been in oversupply since the start of 2018, contract prices of NAND Flash products in 3Q18 registered significant declines from the previous quarter, and the average price drop was 10-15%.
The total revenue of the global DRAM industry grew by 9% QoQ, and again hit a new record high in 3Q18, reports DRAMeXchange, a division of TrendForce. The survey of the price trends in the third quarter shows that contract prices in the mainstream application segments (i.e. PC, server, and mobile) maintained QoQ increases of 0-2%. Particularly, the contract price of mainstream DDR3 consumer DRAM was the first to drop during the quarter because of the weakening demand. Also, contract prices of graphics DRAM products fell by around 3% QoQ due to the sharp drop in the demand related to cryptocurrency mining as well as the higher base of the previous quarter.
The global tablet shipments are expected to decline 4.3% YoY in 2018 to 145.5 million units, as the shipments of entry-level devices are on pace to grow weaker due to the rise of smart speakers and unfavorable currency exchange rates, according to TrendForce.
According to WitsView, a division of TrendForce, the market has witnessed stronger demand for full-screen smartphones while higher screen-to-body ratio has become a major trend of this year. In order to make bezels narrower, drive ICs for mid- and high-end phones have been switching from solutions based on Chip-on-Glass (COG) packaging to those on Chip-on-Film (COF) packaging. With major smartphone vendors actively adopting COF solutions, the percentage of models using COF packaging would account for 35% of the global smartphone market in 2019, a significant increase from 16.5% in 2018.
