Subject


WMCM


2025-12-04

[News] TSMC Speeds Advanced Packaging: AP7 Targets 2026 Output; Arizona P6 Eyed for U.S. Packaging Hub

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

2025-06-09

[News] TSMC Reportedly Delays Equipment Move-In at AP7 Advanced Packaging Facility Amid Safety Incidents

TSMC is actively expanding its advanced packaging capacity. According to Economic Daily News, the company originally planned to move equipment into its AP7 advanced packaging facility in Chiayi, Taiwan during the third quarter, but suppliers have reportedly received updated notices pushing the timel...

2025-01-01

[News] TSMC Sets Up 2nm Pilot Line, Aims for 130,000 Wafers Monthly by 2026

TSMC's next-generation 2nm development is actively progressing. According to MoneyDJ, industry sources indicate that TSMC has begun setting up a pilot production line for 2nm (N2) at its Hsinchu Baoshan fab (Fab 20) this quarter, with a planned monthly capacity of approximately 3,000 to 3,500 wafers...

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