TSMC’s next-generation 2nm development is actively progressing. According to MoneyDJ, industry sources indicate that TSMC has begun setting up a pilot production line for 2nm (N2) at its Hsinchu Baoshan fab (Fab 20) this quarter, with a planned monthly capacity of approximately 3,000 to 3,500 wafers.
Including the contribution from its Kaohsiung fab (Fab 22), the combined monthly capacity for TSMC’s 2nm is projected to exceed 50,000 wafers by the end of 2025 and reach 120,000 to 130,000 wafers per month by the end of 2026, signaling robust demand from major customers, as indicated by the report.
The report, citing sources, further notes that TSMC’s Hsinchu Baoshan 2nm fab will achieve a monthly capacity of 20,000 to 25,000 wafers by the fourth quarter of 2025, scaling up to 60,000 to 65,000 wafers per month by the end of 2026 or early 2027.
As for the Kaohsiung fab, it is expected to achieve a monthly capacity of 25,000 to 30,000 wafers by the end of 2025, further expanding to 60,000 to 65,000 wafers per month by the end of 2026 or early 2027.
TSMC Chairman C.C. Wei previously emphasized that customer demand for 2nm technology surpasses that for 3nm, and the company is actively working to expand production capacity. Industry sources reveal that Apple will be TSMC’s first customer for 2nm, with other major players such as MediaTek, Qualcomm, Intel, NVIDIA, AMD, and Broadcom anticipated to follow in adopting this advanced technology.
Additionally, the report mentions that TSMC disclosed at the IEEE International Electron Devices Meeting (IEDM) that N2 technology can reduce power consumption by 24% to 35% or improve performance by 15% at the same voltage. Furthermore, the transistor density of 2nm is 1.15 times higher than that of the previous 3nm generation.
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(Photo credit: TSMC)