TSMC is actively expanding its advanced packaging capacity. According to Economic Daily News, the company originally planned to move equipment into its AP7 advanced packaging facility in Chiayi, Taiwan during the third quarter, but suppliers have reportedly received updated notices pushing the timel...

TSMC's next-generation 2nm development is actively progressing. According to MoneyDJ, industry sources indicate that TSMC has begun setting up a pilot production line for 2nm (N2) at its Hsinchu Baoshan fab (Fab 20) this quarter, with a planned monthly capacity of approximately 3,000 to 3,500 wafers...