TSMC is scheduled to hold a media tour in Chiayi on the 22nd, marking the first time its Chiayi AP7 site will be opened to local media. According to Commercial Times, construction at TSMC’s Chiayi facilities is progressing at full speed. Supply-chain sources note that AP7 Plant 2 began equipment i...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a 2nm process for the A20-series chip used in the iPhone 18, Apple is set to upgrade packaging technology from the current InFO (Integrated Fan-Out) process to WMCM (Wafer-Level...

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

TSMC is actively expanding its advanced packaging capacity. According to Economic Daily News, the company originally planned to move equipment into its AP7 advanced packaging facility in Chiayi, Taiwan during the third quarter, but suppliers have reportedly received updated notices pushing the timel...