As the public comment window for the U.S. Section 232 semiconductor probe closes this Wednesday (May 7), the chip industry is holding its breath over whether tariffs are coming—and how steep they’ll be. However, as responses have been usually quiet, concerns have been sparked on the lack of push...

Following its North America Technology Symposium, TSMC has shared fresh details on its CoWoS (Chip on Wafer on Substrate with silicon interposer) roadmap. According to Tom’s Hardware, Kevin Zhang, TSMC’s Senior Vice President and deputy COO, confirmed how companies like Cerebras and Tesla (with ...

According to Wccftech, TSMC might delay its adoption of High-NA EUV, with the company expected to bypass the tool for its A14 process and instead continue using 0.33-NA EUV, a move revealed by Senior Vice President Kevin Zhang at the NA Technology Symposium and noted by BITS&CHIPS. Still, the...

Intel’s new CEO, Lip-Bu Tan, has just completed his first earnings call, demonstrating a strong commitment to driving the company’s transformation. As noted by a report from Commercial Times, Intel’s next-generation CPU, Nova Lake, will combine in-house production with outsourcing to TSMC for ...

At TSMC’s North America Technology Symposium, the foundry giant rolled out an ambitious roadmap for its CoWoS technology. Meanwhile, major customer NVIDIA is showing signs of strong momentum too. According to Commercial Times, NVIDIA’s production schedule for its B300 series has reportedly been ...