Amid surging demand for advanced packaging, key materials are now hot commodities for tech giants. According to EE Times China and the Economic Daily News, Japan’s Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to semiconductor firms like TSMC and Samsung, plans to cut PIMEL shipments...

As the public comment window for the U.S. Section 232 semiconductor probe closed in early May, tension simmered across the chip industry—many feared that the lack of public response could increase the chances of steep tariffs. But according to data released by the Bureau of Industry and Security o...

According to Liberty Times, citing Business Post, Ireland unveils a new plan outlining a series of support measures aimed at advancing its semiconductor industry. The government is reportedly offering subsidies worth several billion euros to attract tech giants like TSMC and Samsung to invest in the...

During the international press conference for Computex 2025,  NVIDIA CEO Jensen Huang, when asked whether NVIDIA might use Samsung or Intel for advanced packaging in the U.S., said the technology is highly advanced and that NVIDIA currently has no alternative—reaffirming TSMC as its sole partn...

Amid tariff pressures, TSMC is ramping up new capacity both at home and overseas. According to CNA and MoneyDJ, the foundry giant plans to build nine new facilities in 2025—eight fabs and one advanced packaging plant—across its global footprint. Most of the newly added capacities will feature...