TSMC is actively expanding its advanced packaging capacity. According to Economic Daily News, the company originally planned to move equipment into its AP7 advanced packaging facility in Chiayi, Taiwan during the third quarter, but suppliers have reportedly received updated notices pushing the timel...

TSMC Chairman C.C. Wei said at yesterday’s shareholder meeting that AI demand remains strong despite tariff concerns—and the momentum is clear. On June 3, major client Broadcom announced it has begun shipping its latest AI-focused networking chip, the Tomahawk 6, according to its press release. ...

At its annual shareholders’ meeting on June 3, TSMC Chairman and CEO C.C. Wei addresses concerns about tariff-related risks. As noted by Central News Agency, Wei says that despite ongoing uncertainty and potential impacts from tariff policies, TSMC sees no changes in customer behavior, reaffirming...

As TSMC prepares for 2nm mass production in 2H25, wafer prices have reportedly hit $30,000 per unit for 2nm and could soar to $45,000 at future nodes, according to Commercial Times. Despite the steep cost, major CSPs are set to follow AMD, NVIDIA, and Broadcom in adopting the node in the next 2 year...

TSMC has been accelerating its global expansion. According to a report from Commercial Times, citing Reuters, TSMC plans to establish a chip design center in Munich, Germany, which is expected to officially launch in the third quarter of 2025. As Commercial Times highlights, this will be TSMC’s fi...