Subject


TSMC


2023-09-06

Huawei’s Mate 60 Pro Impresses Market, SoC Competition Key Against Qualcomm/MediaTek

Huawei's official website unexpectedly unveiled its latest flagship smartphone, the Mate 60 Pro, on August 29, 2023, followed by the release of the Mate 60 the next day. The Mate 60 Pro's performance, powered by the Kirin 9000S SoC, has garnered significant attention in the market. TrendForce's I...

2023-09-05

[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging

According to Taiwan's TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High Bandwidth Memory (HBM) products. ...

2023-09-04

[News] Chiang Shang-yi, Former TSMC Co-COO, Shares China Experience and CoWoS Development

According to Taiwan's TechNews report, Chiang Shang-yi, former TSMC Co-COO and current Chief Semiconductor Strategist at Foxconn, shared insights during a Taiwan Television interview. He discussed his past role at TSMC, the potential impact of U.S. export restrictions on China's semiconductor develo...

2023-09-04

[News] Amid Uncertain Market, TSMC to Avoid Supplier Price Cuts Next Year

According to a report from Taiwan's TechNews, as we approach the fourth quarter, which marks the peak period for negotiations between the semiconductor manufacturing leader TSMC and its suppliers, the supply chain is indicating that TSMC is expected to follow a similar approach to that of 2022. This...

2023-09-01

[News] Rumored AI Chip Demand Spurs Price Hikes at TSMC, UMC, ASE

TSMC's CoWoS advanced packaging capacity shortage is causing limitations in NVIDIA's AI chip output. Reports are emerging that NVIDIA is willing to pay a premium for alternative manufacturing capacity outside of TSMC, setting off a surge in massive overflow orders. UMC, the supplier of interposer ma...

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